The R/F module connectors are strapped to an on-board 4:1 R/F combiner circuit. While maintaining good isolation between the inputs, the combiner has its low loss R/F sum port wired to the SMA type front panel antenna connector, for minimum external antenna cabling effort.

An on-board PCI Express® to quad USB 3.0 5Gbps controller is used as upstream connection from the M.2 sockets to the CompactPCI® Serial CPU card.

• General
  • PICMG® CompactPCI® Serial Standard (CPCI-S.0) Peripheral Slot Card
  • Single Size Eurocard 3U 4HP 100x160mm²
  • CompactPCI® Serial backplane Connector P1
  • Suitable for PCIe x1 Gen2 peripheral slots

• USB Controller
  • Texas Instruments PCI Express® to quad-port USB 3.0 controller TUSB7340
  • PCI Express® x 1 Gen2 interface for optimum performance
  • USB 3.0 xHCI (eXtensible host controller interface) SuperSpeed supported
  • USB 2.0 high-speed, full-speed, low-speed supported
  • Drivers available for download

• M.2 Sockets
  • 4 x M.2 sockets, for 30mm x 42mm cards, B-key
  • Socket 2 WWAN configuration according to PCI Express M.2 Specification Rev. 1.1 2016
  • USB controlled host I/F, USB 3.0 and USB 2.0
  • Future proof by USB 3.0 SuperSpeed, maximum data rate 5Gbps full duplex
  • Legacy compliant 2G/3G/4G (LTE) by USB 2.0 480Mbps
  • +3.3V power supply, 3.7A typ. current limited electronic power switches, option I2C controlled M.2 socket power on/off
  • F/P Mini SIM card holder associated to each socket, 2 x dual-slot
  • Suitable for 25mm x 15mm 2FF UICC, often referred to as 'Standard SIM'
  • Front panel screw lock solution available for Mini SIM cards
  • Front panel LED array associated to M.2 modem LED outputs
  • Common F/P antenna connector SMA R/P for simplified external antenna cabling
  • Custom specific F/P design for additional pigtail antenna connectors (8HP/12HP width)

• R/F Combiner/Splitter Circuit
  • Mini-Circuits SEPS-4-272+, on-board soldering, 4:1
  • 690-2700MHz, 50 Ohm
  • Isolation 20dB typ.
  • nsertion loss 7dB typ. 800-2200MHz
  • Active antenna DC current 1A max. (250mA per port)
  • On-board R/F strapping from M.2 WWAN modules (e.g. diversity antenna connector) to combiner/splitter via e.g. Hirose W.FL or I-PEX MHF4 or Murata HSC (2x2mm2) coaxial connectors and cable assemblies
  • Combiner/splitter bypassing option w. pigtail antenna connectors (custom specific F/P required e.g. 8HP width)

• Applications
  • WWAN e.g. 3G 4G LTE with or w/o data transfer rate aggregation
  • Railway, transportation
  • Industrial IoT networking

• Environment & Regulation
  • Designed & manufactured in Germany
  • Certified quality management according to ISO 9001
  • Long term availability
  • Rugged solution (coating, sealing, underfilling available on request)
  • RoHS compliant
  • Operating temperature: -40°C to +85°C industrial temperature range
  • Storage temperature: -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% ... 95% RH non condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF 58.6 years
  • EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)