The SC9-TOCCATA front panel is provided with three 2.5Gbps Ethernet jacks for networking (2 x TCC/TSN capable) and three 10Gbps USB Type-C receptacles (DisplayPort Alternate Mode enabled) for versatile device and display attachment.

On-board mass-storage solutions are based on low profile mezzanine expansion cards, which accommodate up to two M.2 style SSD modules. One of the M.2 sockets is suitable for a fast NVMe (PCI Express^® Gen4 x 4) module.

The 11th Generation XEON^® and Core™ processors are accompanied by the RM590E mobile PCH, for a maximum of high speed I/O resources (e.g. PCI Express^®, SATA, USB). Altogether with the processor, 25 PCIe^® lanes in total are provided for backplane use, and another 8 lanes for local mezzanine expansion up to PCIe^® Gen4 speed.

As an option, up to eight additional Gigabit Ethernet ports (either switch or NICs) are available via the backplane connector P6 by means of a mezzanine module.

• CompactPCI^® Serial (PICMG^® CPCI-S.0) CPU Card
• Form factor single size Eurocard (board dimensions 100x160mm²)
• Mounting height 3U
• Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
• Front panel I/O connectors for typical system configuration (3 x 10Gbps USB Type-C DP Alt Mode, 3 x 2.5Gbps Ethernet RJ45)
• Backplane communication via PCI Express^® Gen3, SATA 6G, USB 3, Gigabit Ethernet
• New AirMax VSe^® backplane connectors up to 25Gb/s differential pair
• On-board PCIe^® mezzanine expansion option for mass storage modules or side cards
• Side cards and low profile mass storage modules available as COTS and also as custom specific

• Intel^® 11th Generation Mobile XEON^® W or Core™ processor
• Tiger Lake H45 platform
• Up to 8-core, up to 3MB cache per core
• DDR4 3200 ECC RAM
• Gen 12 graphics, 4 displays up to 8k60
• TCC/TSN
• Extended temperature operation
• Embedded & industrial use conditions
• 45/35W configurable TDP, 25W TDP
• BGA soldered for optimum reliability
• Mobile Intel^® Series 500 PCH (RM590E IOTG)

• Intel^® Xeon^® W processors (Industrial Use Case *)
• Up to 8 cores, 24MB cache, 32EU, Intel^® vPro™ eligible
• W-11865MRE | 8c 24M | 4.7GHz | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | -40° C to +100° C | SC9-650D-TOCCATA
• W-11555MRE | 6c 12M | 4.5GHz | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | -40° C to +100° C
• W-11155MRE | 4c 8M | 4.4GHz | 45/35W | 16EU 1250MHz | ECC | TCC/TSN | -40° C to +100° C
• W-11865MLE | 8c 24M | 4.5GHz | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | 0° C to +100° C | SC9-440D-TOCCATA
• W-11555MLE | 6c 12M | 4.4GHz | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | 0° C to +100° C
• W-11155MLE | 4c 8M | 3.1GHz | 25W | 16EU 1250MHz | ECC | TCC/TSN | 0° C to +100° C | SC9-340D-TOCCATA

• Intel^® Core™ processors (Embedded Use Case)
• Up to 8 cores, 24MB cache, 32EU, Intel^® vPro™ eligible
• i7-11850HE | 8c 24M | 4.7GHz | 45/35W | 32EU 1350MHz | VPro | 0° C to +100° C
• i5-11500HE | 6c 12M | 4.5GHz | 45/35W | 32EU 1350MHz | VPro | 0° C to +100° C
• i3-11100HE | 4c 8M | 4.4GHz | 45/35W | 16EU 1250MHz | 0° C to +100° C
• 6600HE | 2c 8M | 2.6GHz | 35W | 16EU 1100MHz | 0° C to +100° C | SC9-140D-TOCCATA

• DL Boost - set of instructions to accelerate AI workloads
• AVX512 - Advanced Vector Extensions & VNNI - Vector Neural Network Instructions - X86 instruction set which is designed to accelerate convolutional neural network for INT8 inference, helps accelerate workloads like image recognition
• GNA - Gaussian & Neural Accelerator - a low-power neural coprocessor for continuous inference at the edge, designated for offloading workloads including but not limited to noise reduction or speech recognition, saves power and frees CPU resources
• Intel^® OpenVINO™ (Open Visual Inference and Neural network Optimization) toolkit 2022 - deploy high-performance, deep learning inference
• Intel^® Edge Software Hub - edge compution software and packages
• Intel^® DevCloud for the Edge - allows you to actively prototype and experiment with AI workloads for computer vision

• Phoenix^® UEFI (Unified Extensible Firmware Interface) V2.7
• Phoenix SCT (SecureCore Technology) Release V4.3.0
• ACPI V6.1
• Fully customizable by EKF
• Secure Boot and Measured Boot supported
• Windows^®, Linux and other (RT)OS' supported
• Intel^® AMT vPro^® supported (disabled by default, must be enabled via BIOS setup)

• Integrated memory controller up to 64GB DDR4 3200 with hardware ECC *
• DDR4 +ECC soldered memory up to 32GB (ultra rugged basic memory)
• DDR4 +ECC SO-DIMM memory module socket up to 32GB (memory expansion option)
• Total memory encryption

• Integrated graphics engine, 4 displays
• Codec support HEVC/SCC/VP9/AV1
• HDR support power optimized
• Decode up to 8k60:
• 2x 4k60 8b 4:2:0 AVC
• 5k60 12b 4:2:2/4:4:4 HEVC/VP9/SCC
• 8k60 12b 4:2:0 HEVC/VP9/SCC
• 4k60 10b 4:2:0 AV1
• Encode up to 8k30:
• 2x 4k60 8b 4:2:0 AVC
• 5k60 10b 4:4:4 HEVC/VP9/SCC
• 8k30 10b 4:2:0 HEVC/VP9/SCC
• 2x 4k HEVC encode speed
• Up to 4 displays supported:
• 1 Display: 8k60 HDR
• 2 Displays: 8k60 SDR or 4k120 HDR + 5k120 HDR
• 3 Displays: 4k60 HDR
• 4 Displays: 4k60 HDR
• DisplayPort DP1.4a HBR3
• Multi-Stream Transport (MST) - display daisy chaining
• Integrated DP Alt Mode MUX
• Integrated audio

• Display front panel options:
• 3 x Type-C connectors (DisplayPort Alternate Mode)
• 4th DisplayPort optional via Type-C connector on low profile mezzanine card S40 or S48

• Up to 11 Gigabit Ethernet networking interfaces in total
• 3 x Front 2.5GBASE-T RJ45 - 3 x Intel^® I226-IT NIC
• 2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T connections
• RJ45 Front port 1 - Intel^® I226-IT, Intel^® vPro^®/AMT (Wake on LAN)
• RJ45 Front port 2 - Intel^® I226-IT, TCC/TSN capable, PPS/PPM
• RJ45 Front port 3 - Intel^® I226-IT, TCC/TSN capable
• Integrated TCC/TSN controller for front ports 2 & 3 (RM590E PCH) - Real Time networking
• TSN Precision time protocol (Time-Sensitive-Networking) as required e.g. for OPC UA and OpenAvnu
• Enables ultra-reliable low-latency communication (URLLC)
• Intel^® Time Coordinated Computing (Intel^® TCC) for time synchronisation and timeliness
• Option 8 x 1000BASE-T backplane w. S80-P6 mezzanine module - Marvell^® Peridot switch
• Option 4 x 1000BASE-T backplane w. S82-P6 mezzanine module - 4 x Intel^® I210-IT NIC
• Option 4 x 2.5GBASE-T backplane w. S83-P6 mezzanine module - 4 x Intel^® I226-IT NIC
• Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card - 4 x Intel^® I226-IT NIC (8HP assy)
• Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM short side card - 4 x Intel^® I210-IT NIC (8HP assy)
• Option RJ45 port 1 jack (vPro^®/AMT) replacement by M12-X connector w. S02-M12 mezzanine (8HP)

• Total memory encryption - hardware based
• ROP attack prevention - hardware based protection against browser malware attacks
• Advanced Crypto Key protection - hardware based

• Trusted Platform Module SLM9670
• TPM 2.0 for highest level of certified platform protection
• Infineon Optiga™ cryptographic processor
• Conforming to TCG 2.0 specification

• 3 x 2.5 Gigabit Ethernet RJ45 receptacles
• 2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te
• Intel^® vPro^®/AMT supported (port 1 RJ45 connector - must be enabled via BIOS settings)
• Port 2 & 3 TCC/TSN enabled

• 3 x 10Gbps USB Type-C receptacles DisplayPort Alt Mode
• USB and/or DisplayPort usage
• USB 3.2 Gen 2x1 (formerly USB 3.1 Gen2) SuperSpeed+ 10Gbps
• USB-PD downstream facing ports 5V/3A (Infineon CYPD5225 EZ-PDT CCG5 controller)
• DisplayPort 1.4
• Additional Type-C front I/O with low profile mezzanine S40 or S48

• Variety of side cards available, common front panel 8HP/12HP with CPU card
• For backplanes with system slot right aligned
• Various I/O ports e.g. UART, Audio, RJ45 Ethernet, M12-X Ethernet, Wireless (SMA)
• Custom specific front panel and side card design

• PICMG^® CPCI-S.0 CPU card & system slot controller
• 16 x PCIe Gen4 ¹ 16GT/s (2 links x8 for two fat pipe slots, derived directly from the Xeon^® or Core™ CPU)
• 9 x PCIe Gen3 8GT/s (1 link x4, 5 links x1 for peripheral slots, derived from the PCH)
• 5 x SATA 6G (from the PCH)
• 8 x USB3 ² (from the PCH)
• Option 8 x Gigabit Ethernet Marvell 88E6390 switch (S80-P6 low profile mezzanine expansion card)
• Option 4 x Gigabit Ethernet Intel^® I210-IT NIC (S82-P6 low profile mezzanine expansion card)
• Option 4 x 2.5Gigabit Ethernet Intel^® I226-IT NIC (S83-P6 low profile mezzanine expansion card)

• New backplane connectors AirMax VSe^® up to 25Gbps per differential pair according to CompactPCI^® Serial R3.0 (backward compatible to backplanes with AirMax VS® 12.5Gbps)
• 4HP CPU card front panel width when the adjacent board to the right is equipped with legacy AirMax VS^® connectors (e.g. peripheral cards according to the CompactPCI^® Serial R2.0 connector specification)
• 5HP CPU card front panel width and backplane slot pitch according to CompactPCI^® Serial R4.0 when the adjacent board to the right is also equipped with the new AirMax VSe^® connectors (e.g. multi CPU card system)

• Mezzanine side card connectors for optional local expansion
• Low profile mezzanine modules available (4HP front panel)
• Side cards available (8HP F/P assembly)
• HSE1 - PCIe Gen4 x4, 1 x USB3 10Gbps & 2 x USB2
• HSE2 - PCIe Gen3 x4 (configurable also 2x2, 4x1), 4thDisplayPort
• EXP - Legacy interface (eSPI, Audio, UART, I2C, GPIO)

• 4HP Low profile mezzanine module preferred options:
• S20-NVME Mezzanine module - 1 x M.2 2280 NVME SSD socket, 1 x Type-C
• S40-NVME Mezzanine module - 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C
• S42-MC Mezzanine module - 1 x M.2 2280 NVME SSD socket, 2 x Mini Card sockets
• S48-SSD Mezzanine Module - 2 x M.2 2280 NVME SSD sockets, 1 x Type-C
• S80-P6 Mezzanine module - 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector
• S82-P6 Mezzanine module - M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
• S83-P6 Mezzanine module - M.2 NVMe SSD socket, 4 x 2.5GbE NIC via P6 backplane connector
• Custom specific storage & I/O module design

• 8HP Mezzanine side card options:
• SCJ-VEENA Short side card - M.2 2280 NVMe SSD socket, 4 x 2.5GbE NIC, front panel RJ45, USB3
• SCL-RHYTHM Short side card - M.2 2280 NVMe SSD socket, 4 x GbE NIC, front panel M12-X
• SCZ-NVM - M.2 22110 NVMe SSD socket, quad UART, DisplayPort & USB3 connectors
• S02-M12 - RJ45 port 1 (vPro^®/AMT) replacement by M12-X connector (top or bottom mount)
• Custom specific side card design - I/O and storage

• Backplane Coupler:
• SCX-PCIE - M.2 2280 NVMe/SATA SSD socket, PCIe^® Mini Card socket, 3 x USB3, 3 x GbE RJ45 connectors, coupler for secondary CompactPCI^® Serial backplane
• ECX-PCIE - Front I/O same as SCX, coupler for CompactPCI^® Express secondary backplane

• Available on request

• High performance industrial and embedded computing, for x86 based software
• Automation, process control, test systems, demanding applications
• Edge computing, AI deep learning

• Designed & manufactured in Germany
• ISO 9001 certified quality management
• Long term availability
• Rugged solution
• Coating, sealing, underfilling on request
• Lifetime application support
• RoHS compliant
• EC Regulatory EN55035, EN55032, EN62368-1
• Operating temperature -40°C to +85°C (industrial temperature range)
• Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
• Humidity 5% ... 95% RH non Condensing
• Altitude -300m ... +3000m
• Shock 15g 0.33ms, 6g 6ms
• Vibration 1g 5-2000Hz
• MTBF 20.2 years (MIL-HDBK-217F, SN29500 @+40°C)