EKF - Short Profile
EKF - Short Profile
GC600 • GC610 • X86 SBC

Intel® Atom™ E3900 Series Processor • Apollo Lake SoC

Embedded Gold • Ready-for-Use Industrial PCB Assembly

GC600 • GC610

Description


Product Information

Block Diagram GC600 GC010



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Embedded Gold Ready-for-Use Industrial PCB Assembly

GC600 • GC610 • Single Board Microcomputer
Intel® Atom™ E3900 Series Processor • Apollo Lake SoC




Feature Summary

General
  • Low power X86 based single board computer (SBC)
  • Intended for rugged industrial applications, ready-for-use (Embedded Gold)
  • Industrial PCB assembly
  • PCB Dimensions 133.0mm x 138.0mm (h x w)
  • Intel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable GC600/GC610 versions)
  • Versatile standard I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)
  • Choice of two versions - without (GC600) or with (GC610) wireless networking WLAN - WWAN - BT
  • SMA/SMA-RP antenna connectors (GC610)
  • M12 power connector
  • Option terminal block power connector
  • Wide range DC power input operation 9-57V

I/O Connectors
  • Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)
  • 1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate
  • Dual USB 3.0 Type-A receptacles
  • Dual DisplayPort connectors
  • M12-A DC power connector
  • Option terminal block 3.5mm pitch 4-position screw lock power input

Additional I/O GC610
  • GC610 is the wireless version of GC600
  • Assembly of the GC600 base board and a GC010 4HP mezzanine module
  • SMA/SMA-RP on-board antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5, GNSS
  • Module RF to PCB by MHF4 to MHF4 coaxial patch cables
  • Optional SMA antenna connectors by MHF4 to SMA/SMA-RP pigtail cables
  • Dual Micro-SIM card slot for WWAN modem up to 5G

Processor
  • Intel® Apollo Lake (APL-I) SoC E39xx Series
  • x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
  • x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
  • x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
  • Graphics Burst, CPU Burst, Intel® Speedstep®
  • Intel® Virtualization Technology (Intel® VT-x / VT-d)
  • Intel® Trusted Execution Engine (Intel® TXE) 3.0

Firmware
  • Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
  • Fully customizable by EKF
  • Secure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®
  • Windows®, Linux and other (RT)OS' supported
* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'

Main Memory
  • Integrated memory controller up to 8GB DDR3L 1600 +ECC
  • Soldered memory for rugged applications

Mass Storage
  • On-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)
  • Up to 2TB capacity as of current - refer to GC600/610 SKUs
  • Option Micro SD Card socket (SDHC, SDXC), available on request
  • SPI Flash 128Mbit (UEFI firmware and customer application data)
  • Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)
  • Option mezzanine storage expansion via HSE connector (up to 2 x PCIe®, 1 x USB 3.0)
  • Option custom specific mezzanine board design on request

Graphics
  • Integrated HD Graphics Engine, Gen 9 LP
  • DirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3
  • HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8
  • HW video encode H264, SVC, AVC, MVC, MPEG-2
  • Content protection PAVP, HDCP 1.4
  • 2 x DisplayPort connectors
  • DisplayPort™ 1.2a
  • Max Resolution 4096 x 2160 @60Hz
  • Audio streams encoded

Networking
  • Dual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
  • Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
  • IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
  • IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
  • IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
  • Two M12-X circular connectors
  • Option 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)

Wireless Networking GC610
  • Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)
  • Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)

APL SoC I/O Usage
  • 2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIeŽ/SATA)
  • 2 x PCIe® to 2 x I210-IT networking controllers
  • 2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)
  • 1 x USB 3.0 to P-HSE high speed expansion port connector
  • 2 x USB 3.0 to Type-A connectors
  • 2 x DisplayPort to DP connectors
  • 1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
  • SDIO (Micro SD Card) slot (option)
  • LPC to TPM 2.0 module (option)

Building Blocks
  • 2 x Gigabit Ethernet controllers Intel® I210IT (front panel)
  • Option 1 x Intel® I210-IS (for SerDes networking expansion port connector)
  • M.2 socket for 2280 SSD
  • Option e•MMC (embedded MMC 5.0 64GByte HS400)
  • Option Trusted Platform Module TPM 2.0

GC610 Additions
  • M.2 socket for 2230 Wi-Fi module
  • M.2 socket for 3042 WWAN module (up to 3052 & 3060 extended 5G module)

Security
  • Trusted Platform Module (option)
  • TPM 2.0 for highest level of certified platform protection
  • Infineon Optiga™ SLB 9665 cryptographic processor
  • Conforming to TCG 2.0 specification
  • AES hardware acceleration support (Intel® AES-NI)

Local Expansion
  • Mezzanine card connectors HSE and SERDES for optional local expansion
  • HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0
  • Choice of HSE based mezzanine I/O or storage modules
  • GC010 HSE based wireless module for Wi-Fi, Bluetooth, WWAN, GNSS connectivity (GC610)
  • Custom specific HSE based mezzanine module design
  • Option SERDES connector - Gigabit Ethernet SerDes I/F derived from I210-IS NIC
  • Custom specific SERDES based mezzanine switching module design

Power Requirements
  • DC Input, 9V-57V (e.g. 12VDC, 24VDC, 48VDC nominal input voltage)
  • Power consumption 25W max.
  • Fast acting chip fuse (PCB soldered type - no replacement on-site)
  • Protected against reverse polarity
  • ESD protection (TVS)
  • Common mode input filter
  • M12-A 5-pin power connector
  • Option terminal block 3.5mm pitch 4-position screw lock power input

Applications
  • Ultra compact industrial PC
  • X86 code compatibility for rapid time to market
  • Machine control
  • Kiosk systems, information panels
  • Dual 4k display solution, independent operation
  • Single display or headless applications
  • Industrial networks - IIoT
  • Cable and wireless networking
  • Router, bridges
  • Rugged environments
  • Edge computing
  • Vehicles, transportation

Environmental, Regulatory
  • Designed & manufactured in Germany
  • Certified quality management according to ISO 9001
  • Long term availability
  • Rugged solution
  • Conformal coating, sealing, underfilling on request
  • RoHS compliant
  • Operating temperature -40°C to +85°C (industrial temperature range) available
  • Storage temperature -40°C to +85°C, max. gradient 5°C/min
  • Humidity 5% ... 95% RH non condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • EC Regulatory EN55024, EN55032, EN62368-1 (CE)
  • MTBF tbd years (GC600)
  • MTBF tbd years (GC610)
all items are subject to changes

GC600 - Simplified Block Diagram

GC600 - Simplified Block Diagram

GC010 - Simplified Block Diagram

GC010 - Simplified Block Diagram